下一页 尾页 页码:1/10 | 产品型号 | 厂商 | 封装 | 简要描述 | 图片 | 资料 | 订购 | ISL8485EIB | INTERSIL/RENESAS | SOP8 | RS485集成电路芯片 | | | | | TD541S485H | MORNSUN金升阳 | DFN16(10X13) | RS-485隔离型半双工增强型收发器通讯速率1Mbps | | | | | MURS260T3G | ON | SMB | 超快恢复二极管2A600V | | | | | TD341S232H | MORNSUN金升阳 | DFN-20 | 低功耗、高静电防护ESD保护的RS232收发器 | | | | | TD301D232H | MORNSUN金升阳 | DIP-7 | 单路高速RS232隔离收发模块 | | | | | TDH541S485S | MORNSUN金升阳 | DFN16(10X13) | RS-485隔离型半双工增强型收发器通讯速率20Mbps | | | | | TDH541S485H | MORNSUN金升阳 | DFN16(10X13) | RS-485隔离型半双工增强型收发器通讯速率1Mbps | | | | | TD501M485 | MORNSUN金升阳 | DIP-8 | 单路高速小体积RS485隔离收发模块 | | | | | TD301M485 | MORNSUN金升阳 | DIP-8 | 单路高速小体积RS485隔离收发模块 | | | | | TDH541S485H-A | MORNSUN金升阳 | DFN16(10X13) | RS-485隔离型半双工增强型收发器通讯速率500kbps | | | | | SCM3406ASA | MORNSUN金升阳 | SOP-8 | 半双工增强型收发器RS-485接口芯片 | | | | | HRS4H-S-DC12V-C | HKE | DIP5 | 继电器 | | | | | TPT7482 | 3PEAK | WSOP16,WSOP8 | 工业级隔离RS485收发器芯片 | | | | | TPT7481 | 3PEAK | WSOP16,WSOP8 | 工业级隔离RS485收发器芯片 | | | | | TPT7488 | 3PEAK | WSOP16,WSOP8 | 工业级隔离RS485收发器芯片 | | | | | TPT7487 | 3PEAK | WSOP16,WSOP8 | 工业级隔离RS485收发器芯片 | | | | | TPT3232E | 3PEAK | SOP16,SSOP16,TSSOP16 | 工业级RS232收发器芯片 | | | | | TP8485E | 3PEAK | SOP8,MSOP8 | 工业级RS485收发器芯片 | | | | | TPT75176H | 3PEAK | SOP8,MSOP8,DFN3X3-8 | 工业级RS485收发器芯片 | | | | | TPT75176B | 3PEAK | SOP8,MSOP8,DFN3X3-8 | 工业级RS485收发器芯片 | | | | |
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